Let’s face it, everybody hates dust. It has very few redeeming features and it causes a whole lot of damage… The average house accumulates 40 pounds of dust each year. No one is immune. Lurking in dust are dust mites (rapidly breeding and multiplying), insect waste, mold, toxic chemicals linked to heath issues and much more. Disturbingly, the average person breathes in around 50 million dust particles per hour.
In our last blog we talked about the limitations of Active Cooling. Dust is a big one - “Fan based active cooling systems require open inlet vents that result in dust being dragged into the device wreaking havoc.” Fans require high air flow to cool devices and more air flowing in inevitably means more dust.
Electronics devices have become indispensable to everyone. Imagine life without your cell phone or your laptop. Perhaps for a few seconds you imagine a blissful peace and quiet, but pretty fast you realize exactly how much of your life is entwined with these devices – from your employment, your social life, your treasured memories, your hobbies and entertainment, to connecting with the most important people in your life. Electronic devices have quickly become tools we can’t function without, as the capabilities built into these ever smarter, faster and smaller devices continue to improve, this is unlikely to change.
This week the Frore Systems Blog caught up with Surya Ganti, Founder and CTO, to chat about the progress of AirJet, it’s groundbreaking technology, and how far the company has come.
At CES2024, Frore Systems and Micron added yet another record breaking performance demo with AirJet®.
Introducing a slimmer, smarter, AirJet® chip for increased performance even in the thinnest electronic devices! We are excited to kick off the new year at CES2024 with the launch of a new AirJet chip - AirJet Mini Slim - a thinner, lighter, smarter and even more advanced solid-state active cooling chip. AirJet®Mini Slim, featuring the same groundbreaking solid-state active cooling design of AirJet Mini, includes three new features, while remaining silent, lightweight and delivering superior heat removal compared to traditional fans.
The Boundary Layer is a thin layer of fluid created along surfaces as fluid moves across it. Every surface, from your hand, to the surface of a heat sink used to cool electrical devices, is surrounded by a boundary layer. In electronic devices, the boundary layer creates an insulating blanket of air molecules across hot surfaces that inhibits heat dissipation.
The Frore Systems Blog caught up with the company’s VP of Business Development, Brandon Jung, to explain the sometimes tricky dynamics of selling innovation in a startup environment.
After unveiling the AirJet®Mini with great enthusiasm at CES in January 2023, we're humbled to announce that just 12 months later we have been honored with CES®2024 ‘Best of Innovation’ Award. In addition AirJet has been recognized as CES® 2024 Innovation Awards Honoree in both the Computer Hardware & Components, and Embedded Technologies categories.
The Frore Systems Blog caught up with the company’s VP of Marketing, Sue Ryan, to get her thoughts on AirJet, the market, customers and the future of the small and mighty solid-state active cooling chip.
ZOTAC’s ZBOX PI430AJ with AirJet® features the revolutionary solid-state cooling chip from Frore Systems. Using AirJet, this trailblazing Mini PC has doubled its performance and includes an array of features previously only available in larger systems - finally giving customers what they need in a compact form.
ZOTAC, our partner in developing the first solid-state actively cooled Mini PC – the ZBOX pico PI430AJ with AirJet® - has been honored with Japan’s prestigious GOOD DESIGN AWARD.
從今天開始，消費者可以購買ZOTAC搭載AirJet®的ZBOX PI430AJ。此款具開創性之Mini PC的特點，是採用了Frore Systems推出的革命性固態冷卻晶片AirJet，使得其性能提升了一倍，而且加入了以前只有在更大型的系統中才能獲得的功能 – 終於讓客戶可以在精簡版產品中獲得他們所需要的一切。
Devices are getting increasingly compact. Every fraction of a millimeter of internal device space is carefully designed by manufacturers to create the smallest and most powerful devices possible. Designs aimed at satisfying consumers’ demand for increased performance in ever smaller devices.
At the Flash Memory Summit, FMS23, Frore Systems was honored to receive the pretigious Most Innovative Flash Memory Startup Award for the development of AirJet® the world’s first solid-state active cooling chip.
Frore Systems AirJet®, is the world’s first solid-state chip for active device cooling and it is rapidly changing the electronics industry.
Sarah, a manufacturing manager at a large appliance factory, is responsible for overseeing the volume production of a variety of household appliances.
The truth is, heat doesn’t just make your electronics uncomfortably warm to touch – it is far more serious and is a problem that is rarely discussed, mainly due to the mistaken belief there isn’t a real solution.
During its debut at COMPUTEX 2023 Taipei, one of the worlds’ largest computer and technology events, AirJet® Mini, the world’s first solid state active cooling chip, was awarded the coveted “Golden Award” of Best Choice Award in the IC & Components category.
