In precision inspection, crystal-clear imaging is crucial — especially in fields like semiconductors, food safety, and solar cell analysis. For SWIR camera users, this clarity hinges on stable sensor temperatures, which has traditionally been difficult and costly to maintain.
Embedded systems are specialized computers found in everyday devices like smart gadgets, medical equipment, and cars. As they become more advanced, they require more AI processing power, generating excess heat. Managing this heat is crucial to ensuring their efficiency and reliability.
Frore Systems' AirJet® PAK has been nominated for the prestigious Embedded Award 2025 at the Embedded World Conference in Germany. This revolutionary technology aims to transform the Embedded Systems industry by addressing the primary challenge limiting AI performance: heat.
We are so excited to share that AirJet Mini Sport solid-state active cooling chip, designed to support IP68 waterproof devices, has been named Honoree in CES 2025 InnovationAwards program, in the category of Computer Hardware & Components.
What a year! With a slew of recent announcements highlighting major accomplishments throughout 2024, we have clearly demonstrated why AirJet®, the world’s first solid-state active cooling chip, has been embraced by manufacturers needing to keep pace with the increasing performance required to bring AI advancements to market.
Pro Tablets have traditionally been built using repurposed Smartphone CPUs, but Apple has revolutionized the product category by introducing Apple Silicon M-series, purpose built for the MacBook product line, into Pro Tablets. But the realized performance in the iPad Pro is severely limited because it is constrained by heat. Noisy, bulky fans have never been a good fit for the ultra-thin Pro Tablets. AirJet solid-state active cooling chips, which are silent and a mere 2.65 mm thick, now change the game. The iPad Pro upgraded with AirJet realizes the same sustained CPU and AI performance as the 15” MacBook Air.”
At Frore Systems we love showing consumers how much better their user experience could be if popular commercial platforms added AirJet solid-state active cooling to their devices. And the team has done it again! They demonstrated the massive increase in performance possible with Airjet in the new Samsung Galaxy Book4 Edge, the thinnest Notebook on the market at just 10.9mm.
NVIDIA’s brand new 25 Watt “little tiny Jetson Nano”– the Jetson Orin Nano Super - capable of 67 trillion operations per second(TOPS) of AI performance, is going to generate a lot of heat that could limit its performance if the device isn’t supported by adequate cooling. The AirJet PAK 5C-25 is perfect for the job!
Who better to ask about the limitations of AI when it comes to heat than AI itself? As it turns out there is a real “elephant in the room” that no one is discussing when it comes to realizing the incredible potential of AI…. “Heat”.
Through a strong engineering collaboration with iodyne, AirJet has unlocked an incredible range of new features and capabilities for this groundbreaking SSD drive. Iodyne’s incredible vision and deep customer knowledge has created a new portable storage device that offers unprecedented smart features for on-set, edit, VFX, virtual production, broadcast and live event workflows.
Now your SSD drive can go everywhere you go with the highest sustained speeds – on land or in water! At The Future of Memory and Storage Conference 2024, Frore Systems received the Best of Show - Most Innovative Technology Award for AirJet® Mini Sport, the world’s first waterproof solid-state active cooling chip.
In response to the ever-growing need for higher cooling performance being driven by the market's insatiable appetite forAI, we are excited to announce the AirJet PAK family, thermal solutions designed to meet the rapidly growing demand for Edge AI solutions. The AirJet®PAKs, only 6mm thick, complement the NVIDIA Jetson Orin system-on-modules, and are available in three sizes.
With our recent Series C fundraising of $80M, we’ll be scaling operations and expanding our product lines to meet the rapidly growing demand for our AirJet® Solid-State Active Cooling solutions that are unleashing the performance of both Edge AI and Data Center AI platforms.
The Frore Blog heard about some fascinating experiments being done by one of our amazing Customer Engineers – ChienYi Lo – so we decided to drop by for a chat.
Let’s face it, everybody hates dust. It has very few redeeming features and it causes a whole lot of damage… The average house accumulates 40 pounds of dust each year. No one is immune. Lurking in dust are dust mites (rapidly breeding and multiplying), insect waste, mold, toxic chemicals linked to heath issues and much more. Disturbingly, the average person breathes in around 50 million dust particles per hour.
In our last blog we talked about the limitations of Active Cooling. Dust is a big one - “Fan based active cooling systems require open inlet vents that result in dust being dragged into the device wreaking havoc.” Fans require high air flow to cool devices and more air flowing in inevitably means more dust.
Electronics devices have become indispensable to everyone. Imagine life without your cell phone or your laptop. Perhaps for a few seconds you imagine a blissful peace and quiet, but pretty fast you realize exactly how much of your life is entwined with these devices – from your employment, your social life, your treasured memories, your hobbies and entertainment, to connecting with the most important people in your life. Electronic devices have quickly become tools we can’t function without, as the capabilities built into these ever smarter, faster and smaller devices continue to improve, this is unlikely to change.
This week the Frore Systems Blog caught up with Surya Ganti, Founder and CTO, to chat about the progress of AirJet, it’s groundbreaking technology, and how far the company has come.
At CES2024, Frore Systems and Micron added yet another record breaking performance demo with AirJet®.
Introducing a slimmer, smarter, AirJet® chip for increased performance even in the thinnest electronic devices! We are excited to kick off the new year at CES2024 with the launch of a new AirJet chip - AirJet Mini Slim - a thinner, lighter, smarter and even more advanced solid-state active cooling chip. AirJet®Mini Slim, featuring the same groundbreaking solid-state active cooling design of AirJet Mini, includes three new features, while remaining silent, lightweight and delivering superior heat removal compared to traditional fans.
The Boundary Layer is a thin layer of fluid created along surfaces as fluid moves across it. Every surface, from your hand, to the surface of a heat sink used to cool electrical devices, is surrounded by a boundary layer. In electronic devices, the boundary layer creates an insulating blanket of air molecules across hot surfaces that inhibits heat dissipation.
The Frore Systems Blog caught up with the company’s VP of Business Development, Brandon Jung, to explain the sometimes tricky dynamics of selling innovation in a startup environment.
After unveiling the AirJet®Mini with great enthusiasm at CES in January 2023, we're humbled to announce that just 12 months later we have been honored with CES®2024 ‘Best of Innovation’ Award. In addition AirJet has been recognized as CES® 2024 Innovation Awards Honoree in both the Computer Hardware & Components, and Embedded Technologies categories.
The Frore Systems Blog caught up with the company’s VP of Marketing, Sue Ryan, to get her thoughts on AirJet, the market, customers and the future of the small and mighty solid-state active cooling chip.
從今天開始，消費者可以購買ZOTAC搭載AirJet®的ZBOX PI430AJ。此款具開創性之Mini PC的特點，是採用了Frore Systems推出的革命性固態冷卻晶片AirJet，使得其性能提升了一倍，而且加入了以前只有在更大型的系統中才能獲得的功能 – 終於讓客戶可以在精簡版產品中獲得他們所需要的一切。
ZOTAC, our partner in developing the first solid-state actively cooled Mini PC – the ZBOX pico PI430AJ with AirJet® - has been honored with Japan’s prestigious GOOD DESIGN AWARD.
ZOTAC’s ZBOX PI430AJ with AirJet® features the revolutionary solid-state cooling chip from Frore Systems. Using AirJet, this trailblazing Mini PC has doubled its performance and includes an array of features previously only available in larger systems - finally giving customers what they need in a compact form.
Devices are getting increasingly compact. Every fraction of a millimeter of internal device space is carefully designed by manufacturers to create the smallest and most powerful devices possible. Designs aimed at satisfying consumers’ demand for increased performance in ever smaller devices.
At the Flash Memory Summit, FMS23, Frore Systems was honored to receive the pretigious Most Innovative Flash Memory Startup Award for the development of AirJet® the world’s first solid-state active cooling chip.
Frore Systems AirJet®, is the world’s first solid-state chip for active device cooling and it is rapidly changing the electronics industry.
Sarah, a manufacturing manager at a large appliance factory, is responsible for overseeing the volume production of a variety of household appliances.
The truth is, heat doesn’t just make your electronics uncomfortably warm to touch – it is far more serious and is a problem that is rarely discussed, mainly due to the mistaken belief there isn’t a real solution.
During its debut at COMPUTEX 2023 Taipei, one of the worlds’ largest computer and technology events, AirJet® Mini, the world’s first solid state active cooling chip, was awarded the coveted “Golden Award” of Best Choice Award in the IC & Components category.
