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Frore Systems unleashes increased performance for Edge AI with AirJet®PAK, an ultra-thin, plug and play, active heat removal solution.

Frore Systems unleashes increased performance for Edge AI with AirJet®PAK,  an ultra-thin, plug and play, active heat removal solution.

Everyone…meet the new AirJet®PAK!

In response to the ever-growing need for higher cooling performance being driven by the market's insatiable appetite forAI, we are excited to announce the AirJet PAK family, thermal solutions designed to meet the rapidly growing demand for Edge AI solutions.  The AirJet®PAKs, only 6mm thick, complement the NVIDIA Jetson Orin system-on-modules, and are available in three sizes:

* The AirJet®PAK 5C-25 removing up to 25 watts of heat and supporting up to 100 TOPS
* The AirJet®PAK 3C-15 removing up to 15 watts of heat and supporting up to 70 TOPS
* The AirJet®PAK 2C-10, removing up to 10 watts of heat and supporting up to 50 TOPS

TheAirJet PAK integrates multiple AirJet chips, to remove the increasing heat generated by intense AI workloads.  Removing this heat unleashes the AI performance needed for “Edge AI” in key markets including autonomous vehicles, robotics, industrial automation, smart cities, healthcare, and retail analytics.  

AirJetPAKs are a fully integrated, self-contained, plug and play active cooling solution that are a mere 6mm thick and can be easily added to a host device to enable the performance needed to perform AI workloads at the Edge in smaller, silent, lighter, vibration free, and dustproof, compact devices.  The need for improved cooling to enable AI is increasing rapidly, and with a forecast of demand for Edge AI Computing estimated to increase by over 300% by 2030, it will not slow down anytime soon.

Heat, which limits performance, is now the single biggest problem facing the computing industry. AirJet’s ability to dissipate heat, unleashing performance, is essential for AI applications.

SmartCow, a leading AI engineering company, and an NVIDIA Preferred Partner are excited to be an early adopter of AirJet PAK.  Ravi Kiran, CEO of SmartCow said “We are currently integrating AirJet PAK into a new product line called ‘Uranus+ withAirJet’ - a cutting-edge, faster, smaller, lighter, silent and dustproof AI edge embedded system. We are excited to combine AirJet’s innovative technology with our advanced systems to deliver a truly differentiated product that better enables Smart Cities, Smart Retail, and AIGateway Entrances.” 

AirJet®PAK complements the NVIDIA Jetson Orin Nano and NX Modules inside host devices

The ultra-thin plug and play AirJet PAK active heat removal modules are:

AirJet®PAK 5C-25:  Complementing the NVIDIA Jetson Orin NX 16GB, the AirJetPAK 5C-25 contains 5 AirJet chips, measures 164x63x6mm, removes up to 25 watts of heat, and supports up to 100 TOPS.

AirJet®PAK 3C-15:  Complementing the NVIDIA Jetson Orin Nano 8GB, the AirJetPAK 3C-15 contains 3 AirJet chips, measures 106x63x6mm, removes up to 15 watts of heat, and supports up to 70 TOPS.

AirJet®PAK 2C-10: Complementing the NVIDIA Jetson Orin Nano 4GB, the AirJet PAK 2C-10 contains 2 AirJet chips, measures 106x63x6mm, removes up to 10 watts of heat, and supports up to 50 TOPS.

AirJet PAKs:
* Are fully self-contained, plug and play thermal solutions that include multiple AirJet chips and the drive circuitry
* Mount directly on NVIDIA’s Jetson Orin Nano/NX Modules
* Operate autonomously
* Enable thin, silent, vibration free and dustproof high performance
* Support up to 100 TOPS
* Dissipate up to 25 Watts of Heat  

TheAirJet PAKs make increasing performance a breeze, enhancing AI processing capabilities in faster, silent, thinner, lighter, vibration free and dustproof devices.

The team recently put the AirJet PAK 5C-25 through its paces, comparing it head-to-head with an enclosure with a traditional bulky fan thermal solution.  Using NVIDIA’s JetPack SDK 5.1.1 and leveraging its complete set of libraries for acceleration of GPU computing, multimedia, graphics, and computer vision - the test results are illuminating.

Easily outpacing the traditional fan cooling in 7 out of 8 benchmarks, with an increase of over 60% for Mobilenet_v1_ssd, the AirJet PAK demonstrates impressive performance.

As Seshu Madhavapeddy, our Founder and CEO stated ““Cooling is critical to enable the performance needed to achieve the AI vision – today and in the future. Traditional bulky and noisy thermal solutions, like fans, simply don’t meet the challenge. We are thrilled to announce the AirJet PAK, an ultra-thin plug and play solution that is scalable and enables Edge AI platform manufacturers to unleash AI performance in compact form factors. The AirJet PAK is an easily integrated thermal solution that makes devices faster, silent, thinner, lighter, vibration free and dustproof. It is the ideal thermal solution for products needing the latest AI capabilities.”

The AirJet PAK leverages all the innovationof the original AirJet Mini Slim chip, integrating multiple chips along with the drive circuitry needed to operate them. This plug and play approach will enable its easy integration into EdgeAI platforms.  The AirJet PAK provides aFPC connector to enable easy connection to the host device.

Sustained Performance andReliability

The AirJet PAK generates 1750 Pascals of backpressure, ensuring effective air flow into and out of the cartridge, even when the air vents are covered with IP54 dustproof filters.  This, together with the AirJet PAKs intelligent self-cleaning capabilities, maximizes reliability and ensures the sustained thermal performance of the AirJet PAK and, as a result, the sustained high performance of the dustproof host device.

The AirJetPAK can independently sense the surrounding temperature using Thermoception, an innovation that allows the AirJet PAK to operate autonomously, optimizing performance and maximizing heat removal without relying on external temperature sensors or communication with the host device. All the AirJet PAK needs to enable exceptional processor performance is a nominal power source from the host device.

Cross Section of AirJet®PAK Cartridge Inside Host Device.

There are a massive number of products searching for the best way to unleash AI performance.

Edge AI requires running increasingly complex AI algorithms and models directly on edge devices and is rapidly transforming Edge computing.  Edge AI requires higher processor performance in increasingly compact form factors which inevitably means increased challenges with heat. AirJet PAK unleashes the enhanced performance needed across many different industries, to realize the full potential of today and tomorrow’sEdge AI applications. Industries include transportation and logistics, industrial manufacturing, smart retail, smart cities, health care and life sciences and agriculture, to name a few...

 

In today’s devices, what often determines performance is the capability of the thermal solution, not just the sophistication of the processor. With AirJet PAKs, compact Edge AI devices can now deliver on the full promise of cutting-edge AI technology.

 

 

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Published:
May 30, 2024
May 30, 2024

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