A revolution in cooling technology
for high performance applications

Designed to futureproof data centers

LiquidJet’s customizable unique multi-stage 3D short-loop jetchannels remove 75% more heat and support 2x higher hotspot power density. LiquidJet Nexus, the integrated lightweight coldplate system for ½ U compute trays, supports inlet temperature of 53^oC, weighs only 2.5 kg and eliminates all connectors and hoses.

Created using semiconductor manufacturing processes adapted to metal wafers, LiquidJet unleashes higher performance in powerful AI compute platforms.

Works where fans can’t

Traditional fans need space, large air vents, and moving parts — making them impossible to use in the thinnest, quietest, or most rugged devices.

AirJet^® breaks that barrier. Our solid-state active cooling works silently inside ultra-slim, silent, dustproof, water-resistant, and compact designs where fans simply can't survive.

Performs when passive cooling isn’t enough‍

Passive cooling can only take you so far. As devices get more power-dense, heat spreaders and heat sinks alone can’t keep up.

AirJet^® steps in — delivering active, high-performance cooling without noise or moving parts. Smaller devices. Bigger possibilities.