LiquidJet

DLC Coldplate

Meet LiquidJet: A Direct-to-Chip Liquid Cooling Coldplate

50% higher KW/LPM and supporting 600 W/cm2 hotspot cooling @ 40C inlet temperature

BREAKTHROUGH DESIGN WITH 3D SHORT-LOOP JET CHANNEL MICROSTUCTURES

LiquidJet is a completely new approach to DLC coldplates.

The LiquidJet Coldplate features a breakthrough innovation in DLC coldplate design, with complex 3D short-loop jet channel microstructures. Leveraging Frore Systems’ unique, high-precision semiconductor manufacturing process, adapted to metal wafers, LiquidJet creates a new class of futureproof cooling. 

This unique design, an industry first, enables:

  • 2x higher hotspot power density (600 W/cm2 @ 40ºC inlet temp)
  • 50% higher KW/lpm
  • 10x lower pressure drop
  • Customized designs to exactly match any SOC power map
  • Easy drop-in upgrade

Future-proofed for what’s next, LiquidJet is engineered to scale with next-gen SoCs like NVIDIA Rubin, Rubin Ultra, Feynman (>4,000W) and beyond, as well as for custom hyperscaler ASIC designs. As AI workloads explode, Frore Systems’ LiquidJet architecture is built to keep up.

Performance on the Blackwell Ultra can be seen below:

* Measured on a thermal test vehicle.

LiquidJet’s revolutionary direct-to-chip liquid cooling 3D coldplate solution is designed to meet the escalating demands of AI Data Centers. LiquidJet unlocks higher performance from the world’s most powerful GPUs—starting with NVIDIA Blackwell Ultra—delivering significant reductions in data center total cost of ownership (TCO) and improving power usage effectiveness (PUE).

Airjet Mini Data Sheet

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2x Improvement in Super Slim 13” Notebook 

2x Improvement in Super Slim 13” Notebook

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2x Performance Improvement in
6mm Pro Tablet

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LiquidJet Customizable Cooling

LiquidJet’s unique cellular architecture completely redefines Direct-to-Chip Liquid Cooling (DLC)

Legacy coldplates rely on outdated skiving 2D microchannel manufacturing, limiting their ability to adapt to new chip layouts and increasingly non-uniform high power density requirements.

Frore Systems takes a different approach, adapting semiconductor manufacturing to metal wafers, fabricating 3D short-loop jet channel microstructures. This cellular design approach enables LiquidJet to be designed precisely to the power maps of modern GPUs, enabling:

  • Highly customized coldplate designs
  • Far superior cooling performance
  • Scalable cost-effective manufacturing

The result is LiquidJet - a coldplate that evolves as fast as the chips it cools.

Customized Blackwell Ultra Cooling

GPU hotspot cooling and HBM cooling are crucial in AI data centers for maximizing GPU performance and memory bandwidth, improving energy efficiency, increasing AI Tokens/sec, improving TCO and reducing PUE.

  • Superior hotspot cooling
  • 50% higher KW/lpm
  • 4x lower pressure drop

Airjet Mini Data Sheet

Download PDF

2x Improvement in Super Slim 13” Notebook 

2x Improvement in Super Slim 13” Notebook

Download PDF

2x Performance Improvement in
6mm Pro Tablet

Download PDF

Superior Hotspot Cooling

  • 2x higher hotspot power density
  • 600 W/cm2

Airjet Mini Data Sheet

Download PDF

2x Improvement in Super Slim 13” Notebook 

2x Improvement in Super Slim 13” Notebook

Download PDF

2x Performance Improvement in
6mm Pro Tablet

Download PDF

LiquidJet Coldplate

The LiquidJet DLC coldplate is transforming data center cooling now and into the future with:

  • Cooler GPUs
  • More AI Tokens/sec
  • Lower Total Cost of Ownership (TCO)
  • Improved energy consumption (PUE)

Contact Frore Systems today to discover how LiquidJet can transform and futureproof your operations with an easy drop-in upgrade to your data center racks.