The SSD industry is embracing AirJet® - The World’s First Active Cooling Chip.

At Flash Memory Summit 2023, Frore Systems and SSD industry leaders are showcasing record breaking performance demos in gaming and data storage with AirJet®.

SAN JOSE, California – August 8, 2023 – Today, Frore Systems, the maker of AirJet Mini, the World’s first solid-state active cooling chip, announced technology collaborations with three SSD industry leaders, Phison, Sabrent and OWC, showcasing the power and versatility of the AirJet active cooling chip. The three demonstrations showcase the world’s fastest compact Gaming SSD with AirJet®, the world’s fastest 8TB compact SSD accessory with AirJet® and the first 64TB SSD storage device with AirJet® . The three live demonstrations, showcasing major performance gains enabled by AirJet’s game changing technology , are on display this week at the Flash Memory Summit 2023 in Santa Clara, California.

AirJet removes heat with breakthrough technology that meets the ever-increasing demands of consumers. In both consumer and professional applications, there is a rapidly growing requirement for improved performance which can only be realized through the effective removal of heat. Heat is the single biggest problem facing the electronics industry, and SSDs are no exception. Until now, manufacturers have been forced to use expensive liquid cooling systems or rely on antiquated thermal solutions like noisy mechanical fans or bulky ineffective heat sinks to remove the heat generated by the ever-increasing workloads. These inadequate thermal approaches cause systems to rapidly overheat, forcing reduced performance, throttling after only a few seconds of operation, preventing consumers from getting the full performance they pay for.

Frore Systems’ close collaboration with SSD industry leaders showcases three demonstrations of the major performance gains unleashed by AirJet:

  1. The world’s fastest compact Gaming SSD with AirJet®:  The Phison PS5026-E26 PCIe Gen5 SSD controller with I/O+ Technology actively cooled with 2 AirJet Minis, is the most powerful device in its class; with no throttling, 14,175MB/s sustained sequential read performance and over 1000MB/s PCMark 10 Storage Test performance - a world first for a NAND-based M.2 SSD. More details here.
    Collaboration Partner: Phison Electronics Corp. (TPEX: 8299), a global leader in NAND flash controller and storage solutions:
  2. The world’s fastest 8TB Compact SSD Accessory with AirJet®: A Sabrent 8TB compact SSD accessory with AirJet® demonstrates a 3x sustained performance increase while lowering skin temperature by 20oC. More details here.
    Collaboration Partner: Sabrent, a leading American manufacturer of computer peripherals and accessories.
  3. The first compact 64TB SSD Storage device with AirJet®: A solution for fast, silent, large scale mobile data storage, the 64TB OWC Mercury Pro U.2 Dual storage device with silent active cooling using 8 AirJet Minis, unleashing performance and enabling the fastest, compact, 64TB capacity SSD storage device in its class. More details here.
    Collaboration Partner: OWC a company dedicated to providing reliable solutions for computer hardware, accessories, and software.

“The widespread enthusiasm for AirJet® from the SSD industry emphasizes how significantly AirJet is revolutionizing markets where performance is constrained by heat” said Dr. Seshu Madhavapeddy, founder and CEO of Frore Systems. “Until AirJet, heat removal was the only aspect of modern-day technology that hadn’t changed in decades. The ability to manage heat, creating massive performance gains simply by adopting our easily integrated solid-state active cooling chip, is being embraced by manufacturers who have long struggled with the very real challenge of heat generated by their products.”

Frore Systems launched AirJet Mini in January 2023 and has seen unprecedented demand for the small, highly effective active cooling chip. The AirJet Mini is just 2.8mm thick, 27.5mm x 41.5mm in size, and weighs only 11 grams. AirJet is a scalable solution, with additional heat removal achievable by simply adding more AirJet chips.  Each chip removes 5W of heat, and the easy integration of multiple chips means two chips can remove 10W, three chips 15W and so on. AirJet’s compact size and scalable nature means manufacturers can adopt the heat removal technology in a wide range of applications, enabling increased performance in faster, thinner, lighter, silent, and dustproof devices.

ABOUT FRORE SYSTEMS:

Frore Systems is the developer of breakthrough thermal technology for electronic and consumer devices. The company’s active cooling chip, the AirJet® Mini, is integrated into devices to remove heat silently, resulting in major performance gains. Frore Systems is headquartered in San Jose, CA with an office and manufacturing facility in Taiwan. For more information, visit: https://froresystems.com/

For further information contact:

Sue Ryan VP Marketing
sue@froresystems.com
Cell: +1 314 914 5008

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