AirJet® Demonstrations
Powerful AI Needs a Thermal Solution That Can Keep Up.
Heat is the biggest bottleneck in computing — and with the rise of advanced AI models, the problem is only growing. AI reasoning tasks demand sustained performance, not just quick bursts. That means more processing, more heat…and the need for next-gen thermal solutions.
Lenovo’s breakthrough Active Flow thermal solution, developed in collaboration with Frore Systems, replaces traditional fan-based cooling with a solid-state active cooling architecture powered by AirJet® technology.
For decades, making laptops thinner has meant sacrificing sustained performance. Lenovo Active Flow Thermal Solution powered by AirJet challenges that convention, enabling sustained performance while reducing noise, dust intake, and mechanical complexity. The result is a quieter, cleaner computing experience that feels equally at home on a desk, on a couch, in a coffee shop, or while traveling – without the performance compromises traditionally associated with fanless PCs.
AirJet features:
7.5 W heat removal per chip.
Ultra-thin, whisper-quiet (<21 dBA),
Water-resistant. No fan noise.
No dust buildup. Just pure performance.
Performance you can see and feel.







